USB 3.0 can be presented at the summer forum IDF
After the first wave of conversations about the interface USB 3.0, which should replace the current standard version 2.0 and bring with them tenfold increase in bandwidth, some information has come a break. We remind readers that interface will allow data transfer at speeds up to 4.8 Gbit / s or 600 Mb / s, while the modern version of USB 2.0 can boast as much more modest figures of 480 Mbps.
Once again draw attention to developments in this area makes the coming Forum IDF, already starting August 19 in San Francisco, during which the company Intel, certainly, will present the first turnkey solutions standard USB 3.0. At Giant adjusts so optimistic official press release Intel in which the company announced its readiness to preliminary specifications Extensible Host Controller Interface (xHCI) version 0.9. Note that the specifications relating to software / hardware interface between the operating system and hardware host controller.
At the moment specifications distributed under a license RAND-Z, that is, without the need for licensing royalties, but the benefits may take only the members of USB 3.0 Promoter Group companies and partners that have signed the relevant agreement.
The next version of specifications numbered 0.95 Intel company already plans to prepare for the fourth quarter of 2008.
One can say that work on the standard USB 3.0 being in full swing, and the readiness of specifications allows already work towards the creation of hardware systems. But until you see the first commercial devices are far more - in the world market for products with support for a new universal interface is unlikely to appear before the beginning of 2009.
Finally note that among the organizations supporting the development of USB 3.0, there are such companies as AMD and NVIDIA. It is easy to guess that support the new interface is essential for a successful move in the global market system logic of the new generation, which will be issued in 2009.
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